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 TC4404/TC4405
1.5A Dual Open-Drain MOSFET Drivers
Features:
* Independently Programmable Rise and Fall Times * Low Output Impedance - 7 Typ. * High Speed tR, tF - <30 nsec with 1000 pF Load * Short Delay Times - <30 nsec * Wide Operating Range: - 4.5V to 18V * Latch-Up Protected: Will Withstand > 500 mA Reverse Current (Either Polarity) * Input Withstands Negative Swings Up to -5V
General Description:
The TC4404/TC4405 are CMOS buffer-drivers constructed with complementary MOS outputs, where the drains of the totem-pole output have been left separated so that individual connections can be made to the pull-up and pull-down sections of the output. This allows the insertion of drain-current-limiting resistors in the pull-up and/or pull-down sections, allowing the user to define the rates of rise and fall for a capacitive load; or a reduced output swing, if driving a resistive load, or to limit base current, when driving a bipolar transistor. Minimum rise and fall times, with no resistors, will be less than 30 nsec for a 1000 pF load. For driving MOSFETs in motor-control applications, where slow-ON/fast-OFF operation is desired, these devices are superior to the previously used technique of adding a diode-resistor combination between the driver output and the MOSFET, because they allow accurate control of turn-ON, while maintaining fast turnOFF and maximum noise immunity for an OFF device. When used to drive bipolar transistors, these drivers maintain the high speeds common to other Microchip drivers. They allow insertion of a base current-limiting resistor, while providing a separate half-output for fast turn-OFF. By proper positioning of the resistor, either npn or pnp transistors can be driven. For driving many loads in low-power regimes, these drivers, because they eliminate shoot-through currents in the output stage, require significantly less power at higher frequencies, and can be helpful in meeting low-power budgets.
Applications:
* * * * Motor Controls Driving Bipolar Transistors Driver for Non-overlapping Totem Poles Reach-Up/Reach-Down Driver
Device Selection Table
Part Number TC4404COA TC4404CPA TC4404EOA TC4404EPA TC4404MJA TC4405COA TC4405CPA TC4405EOA TC4405EPA TC4405MJA Package 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin CERDIP Temp. Range 0C to +70C 0C to +70C -40C to +85C -40C to +85C -55C to +125C 0C to +70C 0C to +70C -40C to +85C -40C to +85C -55C to +125C
Package Type
8-Pin PDIP/SOIC/CERDIP
VDD IN A IN B GND 1 2 8 7 A TOP A BOTTOM B TOP B BOTTOM VDD IN A IN B GND 1 2 8 7 A TOP A BOTTOM B TOP B BOTTOM
TC4404
3 4 6 5 3 4
TC4404
6 5
VDD IN A IN B GND
1 2
8 7
A TOP A BOTTOM B TOP B BOTTOM
VDD IN A IN B GND
1 2
8 7
A TOP A BOTTOM B TOP B BOTTOM
TC4405
3 4 6 5 3 4
TC4405
6 5
(c) 2006 Microchip Technology Inc.
DS21418C-page 1
TC4404/TC4405
Because neither drain in an output is dependent on the other, these devices can also be used as open-drain buffer/drivers where both drains are available in one device, thus minimizing chip count. Unused open drains should be returned to the supply rail that their device sources are connected to (pull-downs to ground, pull-ups to VDD), to prevent static damage. In addition, in situations where timing resistors or other means of limiting crossover currents are used, like drains may be paralleled for greater current carrying capacity. These devices are built to operate in the most demanding electrical environments. They will not latch-up under any conditions within their power and voltage ratings; they are not subject to damage when up to 5V of noise spiking of either polarity occurs on their ground pin; and they can accept, without damage or logic upset, up to 1/2 amp of reverse current (of either polarity) being forced back into their outputs. All terminals are fully protected against up to 2 kV of electrostatic discharge.
Functional Block Diagram
1 VDD
TC4404 Inverting 8 (6) Pull-Up 7 (5)
300 mV
Pull-Down
Input
2 (3) 4.7V TC4405 Noninverting
GND
4 Effective Input C 12 pF A (B)
DS21418C-page 2
(c) 2006 Microchip Technology Inc.
TC4404/TC4405
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage ..................................................... +22V Power Dissipation (TA 70C) PDIP........................................................ 730 mW CERDIP .................................................. 800 mW SOIC ....................................................... 470 mW Package Thermal Resistance PDIP RJ-A ............................................. 125C/W PDIP RJ-C ............................................... 45C/W CERDIP RJ-A ........................................ 150C/W CERDIP RJ-C .......................................... 55C/W SOIC RJ-A ............................................. 155C/W SOIC RJ-C ............................................... 45C/W Operating Temperature Range C Version ........................................ 0C to +70C E Version...................................... -40C to +85C M Version ................................... -55C to +125C Storage Temperature Range.............. -65C to +150C
TC4404/TC4405 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25C, with 4.5V VDD 18V, unless otherwise noted. Symbol Input VIH VIL IIN Output VOH VOL RO IPK IDC IR High Output Voltage Low Output Voltage Output Resistance Peak Output Current (Any Drain) Continuous Output Current (Any Drain) Latch-Up Protection (Any Drain) Withstand Reverse Current Rise Time Fall Time Delay Time Delay Time Power Supply Current VDD - 0.025 -- -- -- -- -- -- -- 7 1.5 -- >500 -- 0.025 10 -- 100 -- V V A mA mA Duty cycle 2%, t 300 sec IOUT = 10 mA, VDD = 18V; Any Drain Duty cycle 2%, t 300 sec Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current 2.4 -- -1 -- -- -- -- 0.8 1 V V A 0V VIN VDD Parameter Min Typ Max Units Test Conditions
Switching Time (Note 1) tR tF tD1 tD2 IS -- -- -- -- -- -- 25 25 15 32 -- -- 30 30 30 50 4.5 0.4 nsec nsec nsec nsec mA Figure 3-1, CL = 1000 pF Figure 3-1, CL = 1000 pF Figure 3-1, CL = 1000 pF Figure 3-1, CL = 1000 pF VIN = 3V (Both Inputs) VIN = 0V (Both Inputs)
Power Supply
Note 1: Switching times ensured by design.
(c) 2006 Microchip Technology Inc.
DS21418C-page 3
TC4404/TC4405
TC4404/TC4405 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V VDD 18V, unless otherwise noted. Symbol VIH VIL IIN Output VOH VOL RO IPK IDC IR High Output Voltage Low Output Voltage Output Resistance Peak Output Current (Any Drain) Continuous Output Current (Any Drain) Latch-Up Protection (Any Drain) Withstand Reverse Current Rise Time Fall Time Delay Time Delay Time Power Supply Current VDD - 0.025 -- -- -- -- -- -- -- 9 1.5 -- >500 -- 0.025 12 -- 100 -- V V A mA mA Duty cycle 2%, t 300 sec IOUT = 10 mA, VDD = 18V; Any Drain Duty cycle 2%, t 300 sec Parameter Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current Min 2.4 -- -10 Typ -- -- -- Max -- 0.8 10 Units V V A 0V VIN VDD Test Conditions
Switching Time (Note 1) tR tF tD1 tD2 IS -- -- -- -- -- -- -- -- -- -- -- -- 40 40 40 60 8 0.6 nsec nsec nsec nsec mA Figure 3-1, CL = 1000 pF Figure 3-1, CL = 1000 pF Figure 3-1, CL = 1000 pF Figure 3-1, CL = 1000 pF VIN = 3V (Both Inputs) VIN = 0V (Both Inputs)
Power Supply
Note 1: Switching times ensured by design.
DS21418C-page 4
(c) 2006 Microchip Technology Inc.
TC4404/TC4405
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (8-Pin PDIP, SOIC, CERDIP) 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Symbol VDD
IN A IN B GND
Description Supply input, 4.5V to 18V. Control input A, TTL/CMOS compatible input. Control input A, TTL/CMOS compatible input. Ground. Output B, pull-down. Output B, pull-up. Output A, pull-down. Output A, pull-up.
B BOTTOM B TOP A BOTTOM A TOP
(c) 2006 Microchip Technology Inc.
DS21418C-page 5
TC4404/TC4405
3.0
3.1
APPLICATIONS INFORMATION
Circuit Layout Guidelines
Avoid long power supply and ground traces (added inductance causes unwanted voltage transients). Use power and ground planes wherever possible.
In addition, it is advisable that low ESR bypass capacitors (4.7 F or 10 F tantalum) be placed as close to the driver as possible. The driver should be physically located as close to the device it is driving as possible to minimize the length of the output trace.
+5V Input VDD = 18V 0V 18V Output 1 Input 2 1 8,7 Output CL = 1000 pF 2 +5V Input 0V 18V Input: 100 kHz, square wave, tRISE = tFALL 10 nsec tD1 Output 0V 10% 10% 90% tR 0V 10% 10% tD1 tF 4.7 F 0.1 F 90%
90%
tD2
tR 90%
10%
Inverting Driver
90%
4
tD2
90% tF 10%
Noninverting Driver
FIGURE 3-1:
Switching Time Test Circuit
3.2
Typical Applications
VDD
(4.5V - 18V)
VDD (4.5V - 18V)
From TTL
RT
TC4404
RT
VOUT
From TTL
RIB
TC4405
RIB
GND
GND
FIGURE 3-2: Zero Crossover Current Totem-Pole Switch
FIGURE 3-3:
Driving Bipolar Transistors
DS21418C-page 6
(c) 2006 Microchip Technology Inc.
TC4404/TC4405
+24V 47 k +12V 15V 0.1 F 15V 0.1 F 47 k
Direction (TTL Level)
Speed (PWM)
RT
Motor
RT
ISENSE GND TC4469
TC4404
FIGURE 3-4:
Servo Motor Control
+12V +12V
Switched +12V +5V +5V
From TTL
TC4404
GND
GND Switched -12V
-12V
-12V
FIGURE 3-5:
Reach-Up and Reach-Down Driving
(c) 2006 Microchip Technology Inc.
DS21418C-page 7
TC4404/TC4405
4.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Fall Time vs. Supply Voltage
100 2200 pF
TA = +25C
Rise Time vs. Supply Voltage
100
Rise TIme vs. Capacitive Load
100
TA = +25C
2200 pF
TA = +25C
VDD = 5V
80
1500 pF
80
1500 pF
80
tFALL (nsec)
tRISE (nsec)
tRISE (nsec)
60 1000 pF 40 470 pF 20 100 pF 0 4 6 8 10 12 14 16 18
60 1000 pF 40 470 pF 20 100 pF 0
60
10V 15V
40
20
4
6
8
10
12
14
16
18
0 100
VDD (V)
VDD (V)
1000 CLOAD (pF)
10,000
Fall Time vs. Capacitive Load
100
TA = +25C
Rise and Fall Times vs. Temperature
60
60
Propagation Delay vs. Supply Voltage
CLOAD = 1000 pF TA = +25C
tD2 40
VDD = 5V
80
tFALL (nsec)
50 TIME (nsec)
CLOAD = 1000 pF VDD = 17.5V
50
60
10V 15V
40
40
30
tFALL
DELAY TIME (nsec)
30 tD1 20
20
20
tRISE
0 100
1000 CLOAD (pF)
10,000
10 -55 -35 -15 5 25 45 65 85 105 125 TEMPERATURE (C)
10
4
6
8
10
12 14 VDD (V)
16
18
Effect of Input Amplitude on Delay Time
60
CLOAD = 1000pF VDD = 10V TA = +25C
Propagation Delay Time vs. Temperature
60
VDD = 17.5V VLOAD = 1000pF
Quiescent Supply Current vs. Voltage
10
TA = +25C
50
DELAY TIME (nsec)
50
DELAY TIME (nsec)
tD2
IQUIESCENT (mA)
BOTH INPUTS = 1 1
40
tD2
40
30
30
20
tD1
20
tD1
BOTH INPUTS = 0 0.1
10
0
2
4 6 VDRIVE (V)
8
10
10 -55 -35 -15 5 25 45 65 85 105 125 TEMPERATURE (C)
4
6
8
10 12 VDD (V)
14
16
18
DS21418C-page 8
(c) 2006 Microchip Technology Inc.
TC4404/TC4405
TYPICAL CHARACTERISTICS (CONTINUED)
Quiescent Supply Current vs. Temperature
4.0
VDD = 18V BOTH INPUTS = 1
Pull-Up Output Resistance
25 25
Pull-Down Output Resistance
IQUIESCENT (mA)
3.5
20
20
3.0
RDS(ON) ()
RDS(ON) ()
WORST CASE @ TJ = +150C 15
WORST CASE @ TJ = +150C
15
2.5
10 8
TYP @ +25C
10 8 5
TYP @ +25C
2.0 -55 -35 -15 5
5 25 45 65 85 105 125
4 6 8 10 12 14 16 18
VDD (V)
4
6
8
10
12
14
16
18
TEMPERATURE (C)
VDD (V)
(c) 2006 Microchip Technology Inc.
DS21418C-page 9
TC4404/TC4405
5.0
5.1 5.2
PACKAGING INFORMATION
Package Marking Information Taping Form
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
Package marking data not available at this time.
User Direction of Feed
Pin 1
W
P Standard Reel Component Orientation for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
5.3
Package Dimensions
8-Pin Plastic DIP
Pin 1
.260 (6.60) .240 (6.10)
.045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92)
.070 (1.78) .040 (1.02)
.310 (7.87) .290 (7.37)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87)
3 Min.
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
Dimensions: inches (mm)
DS21418C-page 10
(c) 2006 Microchip Technology Inc.
TC4404/TC4405
Package Dimensions (Continued)
8-Pin CERDIP (Narrow)
.110 (2.79) .090 (2.29) Pin 1
.300 (7.62) .230 (5.84)
.055 (1.40) Max. .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .200 (5.08) .125 (3.18)
.020 (0.51) Min. .320 (8.13) .290 (7.37) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41)
Dimensions: inches (mm)
.150 (3.81) Min.
3 Min.
8-Pin SOIC
Pin 1
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) Typ.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40)
Dimensions: inches (mm)
8 Max.
(c) 2006 Microchip Technology Inc.
DS21418C-page 11
TC4404/TC4405
NOTES:
DS21418C-page 12
(c) 2006 Microchip Technology Inc.
TC4404/TC4405
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels: * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.
(c) 2006 Microchip Technology Inc.
DS21418C-page 13
TC4404/TC4405
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: TC4404/TC4405 Questions: 1. What are the best features of this document? Y N Literature Number: DS21418C FAX: (______) _________ - _________
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21418C-page 14
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
DS21418C-page 15
WORLDWIDE SALES AND SERVICE
AMERICAS
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EUROPE
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02/16/06
DS21418C-page 16
(c) 2006 Microchip Technology Inc.


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